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DAAT® Structural Adhesive Film

DAAT® Structural Adhesive Film

Tecman's most advanced technology to date, DAAT® Dual Action Adhesive Tape, has been formulated to meet the increasingly complex field of structural bonding of multi-materials.…

Advanced Material Solutions Adhesive Film
Preventive Solution to Eliminate Residual Metal Swarf

Preventive Solution to Eliminate Residual Metal Swarf

Tecman have developed a new solution to prevent residual metal swarf entering apertures during manufacturing processes. The solution cuts out the need for a manual process to remove trapped swarf, saving significant production time and resource.…

Advanced Material Solutions
DAAT® for Structurally Bonding Composites

DAAT® for Structurally Bonding Composites

As part of a drive to create the most advanced bonding systems, Tecman is currently investing in developing DAAT® Dual Action Adhesive Tape to Overcome Challenges of Structural Bonding of Composites within the Automotive Industry.…

Advanced Material Solutions Business updates
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