Preventative Solution to Eliminate Residual Metal Swarf
Tecman have developed a new solution to prevent residual metal swarf entering apertures during manufacturing processes. The solution cuts out the need for a manual process to remove trapped swarf, saving significant production time and resource.…
As part of a drive to create the most advanced bonding systems, Tecman is currently investing in developing DAAT® Dual Action Adhesive Tape to Overcome Challenges of Structural Bonding of Composites within the Automotive Industry.…