Electronics & Technology
Engineered components for the Electronics & Technology Industry
Focusing on weight reduction, minimisation, and rapid assembly we have extensive experience in engineering and manufacturing advanced thermal management, bonding, and sealing solutions for the electronics and technology sector.
By combining advanced materials and intelligent conversion techniques with a deep understanding of industry applications, our self-adhesive solutions are designed to enhance the final product whilst providing added value through increased assembly productivity and minimised overall costs.
Partnered with some of the world’s largest adhesive tape and material manufacturers, we have access to an unparalleled range of advanced materials. Our Application Engineers specialise in developing self-adhesive components that provide optimum performance and added value.
Components & Applications
Electronics & Technology Industry
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Thermal Management
Our portfolio of thermal management materials includes graphite, foil, and high-performance adhesive tapes. By combining high performance and product quality with intelligent conversion techniques to deliver sophisticated thermal management solutions designed to optimise your application.
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AFAR Films
Anti-fingerprint anti-reflection (AFAR) protection films are suitable for a wide range of consumer electronics such as mobile phones, tablets, e-readers, notebooks and PC screens. They are ideal for touch screen kiosks, cash registers and ATM’s
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Bonding Pads
Die-cut bonding pads and components are available with peel-off tabs, dry edges and finger-lift tabs to aid removal of the release liner, significantly increasing the speed of assembly by up to 1 second per application.
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CONNECTORS
Our range of connectors is available in various formats for specialist electrical application, including flexible circuits for fine pitch and high density applications. Materials include metallic foils, polyimide films and electrically conductive adhesive for buzz bars, earth connectors, flexible circuits and solderless connections for flex to PCB.
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Cushioning
We work with global leaders in foam technology and offer an extensive range of densities, cell structures, composites, compression rates, conductivities and absorption rates for cushioning requirements.
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EMI/EMC/RFI SHIELDING
A range of components for shielding that combines conductive adhesives with super conductive substrates, such as metallic foils and electrically conductive foams, silicones and woven fabrics
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Gaskets
Utilising advanced materials with a superior compression set, we manufacture gasket to tolerances as low as +/- 50µm. Often using Poron® foam as the core material, these foams offer the best performance in vibration resistance and cushioning, protecting the most sensitive components from damage.
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Seals
By working in partnership with our clients’ design team, we supply bespoke compact, lightweight seals which will offer resistance to water, dust and other contaminant ingression.
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Acoustic Insulation
ALFA® technology high performance acoustic insulation fleece and felt materials are designed for applications requiring superior levels of acoustic reduction whilst retaining significant weight savings. Additionally, open cell and closed cell Urethane Polyether and Polyester foams, new technology semi-open cell EPDM and heavy layer dampening materials all make up our leading acoustic insulation materials.
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Panel Bonding
With the increasing use of HMI technology, bonding panels has become increasingly important. Utilising both Pressure Sensitive Adhesive (PSA) and Thermally Activated Films (TAF) we can achieve the highest adhesion levels with the finest adhesive layers.
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Protection Films
All our screen protectors have excellent anti-scratch properties with a proprietary hard-coating ideal for the aftercare market including optically clear, anti-glare and anti-fingerprint. A specially formulated high-grade silicone adhesive is used to give optimum clarity and clean removal, leaving no residue behind after prolonged usage. Our clear protection films work very effectively on both capacitive and resistive touchscreens and are quick and easy to apply.
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Screen Bonding
An area of high development activity as active and passive touch screens are introduced into everyday objects. The resistive touch panel is made up of several layers, typically a Polyester film, top resistive circuit, conductive ITO film, a bottom resistive circuit layer and a glass or acrylic base. These materials are intricate highly sensitive and the adhesives used for bonding them are equally advanced. The conversion of the materials requires careful handling and highly accurate dimensional tolerances.
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Discuss your application with our technical team
Engineered components for the Electronics & Technology Industry
Tecman is a leading advanced material converter and end-to-end engineering and manufacturing partner for the electronics and technology industries. From concept to high-volume manufacture, we specialise in delivering value-added components that streamline and improve manufacturing assembly processes.
Our engineering, manufacturing, and delivery capabilities have enhanced applications for over 30 years. Ongoing research into new materials and processes, combined with extensive engineering knowledge and lean manufacturing processes enable the development of solutions that not only solve persistent industry challenges but also add tangible value where it counts.
With world-class capabilities and resourceful application engineers, our solutions constantly break new ground. We make a positive difference by collaborating with our clients and applying intelligent, creative thinking to every new project, including our innovative die-cut solutions.